Broadcom buys femtocell chip maker


Femtocells are small, low power cellular base stations that extend coverage indoors where signals are weak. Broadcom Corp. has signed a definitive agreement to acquire Percello Ltd., a privately-held company that develops system-on-a-chip (SoC) solutions for femtocells, for $86 million in cash.

Five good, five bad signs for IC market


We are in the fourth quarter and the outlook is cloudy for the rest of 2010 and heading into 2011. Here are some good and bad signs for the electronics industry.

Understanding system-level energy-management techniques and test


Gina Bonini is the worldwide embedded-system technical-marketing manager for Tektronix. In this article she talks about Power dissipation, Bus energy dissipation, PCI-e low power mode, some power saving modes and low power DDR DRAM.

Intel opens China fab


Intel Corp. has begun operations within its first fab in China, according to Dow Jones. In 2007, Intel won approval to build a $2.5 billion, 300-mm wafer plant in northern China for chip sets. The plan called for the fab to be in the city of Dalian. The fab will produce 65-nm devices.

Intel is also expanding in the U.S. As reported, Intel recently confirmed speculation that it will build a new R&D wafer fab in Hillsboro, Ore., and upgrade other existing U.S. facilities for 22-nm production at a total investment of between $6 billion and $8 billion.

The investment will create 800 to 1,000 permanent high-tech jobs and 6,000 to 8,000 construction jobs, Intel (Santa Clara, Calif.) said. The new development fab in Oregon, to be known as D1X, is slated for R&D startup in 2013.

One analyst thinks the fab will be ''450-mm ready.'' [Via: EETimes]

GlobalFoundries tech park in trouble?


A New York state agency plans to take over a technology park that houses the new 300-mm fab owned by U.S. silicon foundry upstart GlobalFoundries Inc.

GlobalFoundries' wafer fab under construction in New York state, Fab 8, would run the 22-nm production and more advanced nodes. Construction for Fab 8 started in July of 2009. The fab will have 60,000 wafer starts per month once it goes into full production. Production is expected to go online in 2012.

''The Fab 8 project is on schedule and construction is progressing very smoothly. We just have some concerns about a few pieces of infrastructure that need to be delivered. The state and (Luther Forest) are working out the details and we are confident they will address our concerns,'' according to a spokesman for GlobalFoundries.[Via: EETimes]

Is Intel prepping up for 450mm wafer sizes?


Is Intel preparing to push the issue with regard to its desire to move to 450-mm wafer sizes? One analyst thinks so. While most equipment is nowhere near ready at this stage (development has been limited ), C.J. Muse, an analyst with Barclays Capital, thinks the No. 1 chipmaker could specify that its newly announced D1X development fab in Oregon will be 450-mm capable (meaning it can accommodate 450-mm processing when/if the equipment becomes available).

Considering that Intel, Samsung and TSMC have said in the past that they want to see 450-mm development fabs by 2012 (fat chance), Intel almost has no choice but to build D1X with enough space to accommodate 450-mm processing. While the chances of the tools being ready for 450-mm by that date are slim, Intel must at least plan for the contingency if the company wants to send the message to its equipment suppliers that it is serious about this. While the 450-mm ball is rolling to some extent (450-mm wafer specs are ready; handlers and interfaces may be also), the question is when the big gear like lithography, CVD, RTP, etch systems and others, will be ready. Don't be surprised to see Intel make a public statement about this fab being 450-mm capable as a way to turn up the heat and spur tool development by equipment vendors who have mostly been dragging their feet. [via: EETimes]

INDIA Seminar Series 2010 - Modern Design Processes


An exciting agenda has been developed by Altium that will highlight many of the challenges facing today's electronics industry as well as put forward a case for rethinking tools and strategies to better align design capabilities with your current needs

Topics of focus will include:

* Design Process Management
* Design Team collaboration
* Collaborative PCB Design
* Design Data Management
* Version Control
* Also preview exciting new technology coming soon in the latest release of Altium Designer.

Who should attend:
Electronics Engineers, Electronics Managers, Team Leaders, Electronics Designers, Technical Directors, Technical Managers

For more info, please contact:
Rajesh Sawant +91 9663466910

Tech Talk - The Bleeding Edge (Oracle India, Sun Microsystems BU)


Last week i was invited to a Tech Talk organized by Oracle India (Sun Microsystems BU). The title of the talk was "Tech Talk - The Bleeding Edge, Evade your challenges– A dive into critical issues affecting High-end bleeding edge Semiconductors designs and the development engineers face off". The speaker was Mr. Sridhar Vajapey, VP, Hardware Development (Sun Microsystems BU), Oracle Corporation Inc.

The talk was highly informative covering the aspects of Semiconductor process Technology and challenges affecting the lower technology nodes of 28nm. The speaker also provided some very good insight into Sparc processor development, thermal management in a data center and issues with recreating silicon failures. Mr. Sridhar captivated the audience with his detail oriented talk and also dedicated time for answering questions from the audience. What kept me wondering was, how a VP kept himself up to date with technical details, issues and facts of current technologies. By the way did you ever wonder what Cutting edge, Leading Edge and Bleeding edge refer to? Do you know what they really mean?

Infineon takes over LTE specialist "Blue Wonder"


Infineon's Wireless Solutions unit has been working together with the Dresden design house "Blue Wonder" on the development of LTE technologies for one and a half years. Now Infineon has taken over the Saxony-based company together with its 50 employees.

Blue Wonder describes itself as a design house for LTE-IP and mobile communications
solutions serving the telecommunications and semiconductor industries. Blue Wonder’s team is made up of highly qualified specialists for mobile communications
solutions.

The core competencies encompass mobile broadband modem design and OFDMbased system development. First and foremost, the company’s special know-how in LTE Layer 1 supplements and complements the LTE development work of WLS and hence in future of Intel Mobile Communications.

The 4G mobile standard Long Term Evolution (LTE) is the successor of today’s 3G
standard UMTS/HSPA. It provides peak data rates of 150 Mbit/s downlink and 50
Mbit/s uplink. The perfor-mance in surfing the internet, playing online games and in
video telephony is as if the mobile devices were connected via DSL to the fixed
network.

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