Showing posts with label 300mm. Show all posts
Showing posts with label 300mm. Show all posts

Intel opens China fab


Intel Corp. has begun operations within its first fab in China, according to Dow Jones. In 2007, Intel won approval to build a $2.5 billion, 300-mm wafer plant in northern China for chip sets. The plan called for the fab to be in the city of Dalian. The fab will produce 65-nm devices.

Intel is also expanding in the U.S. As reported, Intel recently confirmed speculation that it will build a new R&D wafer fab in Hillsboro, Ore., and upgrade other existing U.S. facilities for 22-nm production at a total investment of between $6 billion and $8 billion.

The investment will create 800 to 1,000 permanent high-tech jobs and 6,000 to 8,000 construction jobs, Intel (Santa Clara, Calif.) said. The new development fab in Oregon, to be known as D1X, is slated for R&D startup in 2013.

One analyst thinks the fab will be ''450-mm ready.'' [Via: EETimes]