Have you ever asked yourself the question: What should I do with the areas under the ICs?
My advise is: If you have a multilayer board then fill them with copper and connect it to GND, unless you have some very sensitive HF analog ICs where feedback is absolutely unwanted. Use at least two vias to the nearest GND layer and add one via for every square centimeter of copper area you have. This copper fill will give you a better shielding of your signals, the IC's will seem less noisy and less sensitive to EMI due to the tighter coupling to GND and you will get better compliance to the EMC standards.
However keep the areas under the ICs currentless - don't try to use them for decoupling or anything like this.
My advise is: If you have a multilayer board then fill them with copper and connect it to GND, unless you have some very sensitive HF analog ICs where feedback is absolutely unwanted. Use at least two vias to the nearest GND layer and add one via for every square centimeter of copper area you have. This copper fill will give you a better shielding of your signals, the IC's will seem less noisy and less sensitive to EMI due to the tighter coupling to GND and you will get better compliance to the EMC standards.
However keep the areas under the ICs currentless - don't try to use them for decoupling or anything like this.
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