Semiconductor
Gallium Nitride: The Wide-Bandgap Semiconductor Powering the Future
Gallium nitride (GaN) is a wide-bandgap compound semiconductor that has become a cornerstone of modern electronics, off…
Market Reports
High-End Performance Packaging Market Report 2025–2030
High-End Performance Packaging Market Report 2025–2030 Executive Summary The High-End Performance Packaging (HEPP) …
Semiconductor
Gallium Arsenide: The Semiconductor Powering Modern Electronics
Gallium arsenide (GaAs) is a compound semiconductor material that has become a cornerstone of the modern electronics in…
Tesla
Tesla’s Robotaxi Revolution: A Ride into the Future Begins in Austin
Picture Coutesy: Hindustan times It’s a warm evening in Austin, Texas, and history is quietly unfolding on the city’s v…
Strategy
The RISC-V Revolution: How New Players Can Ride the Wave in Automotive MCUs
Tech Trendspotter June 2025 Picture this: a sleek electric vehicle hums down the highway, its brain buzzing with ove…
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Semiconductors
China's Automotive Semiconductor Quest: A Drive Toward Self-Reliance
In the high-stakes race for automotive supremacy, China is flooring the accelerator on its semiconductor ecosystem, aim…
Rumours
Samsung and Perplexity AI Deal
Samsung appears to be close to a wide-ranging deal with Perplexity AI, involving investment and integrating Perplexity’…
Shorts
What is an Automotive Edge ECU?
Image Courtesy: ARKK An Edge ECU (Electronic Control Unit) in the automotive context refers to a specialized controller…
ZonalECU
What is a Automotive Zonal ECU?
A Zonal ECU (Electronic Control Unit) is a centralized controller in a vehicle's electrical architecture that manag…
Sensor Fusion
Automotive LiDAR and RADAR Integration with CSI-2 Protocol: Unlocking High-Speed Sensor Data for Autonomous Systems
Image courtesy: MIPI Alliance/Various The MIPI Camera Serial Interface 2 (CSI-2) protocol, developed by the MIPI Allia…
Trends
Analog Security in Multi-Die Systems and Edge Computing: Challenges, Solutions, and Future Trends
Image Source:Altium The shift toward multi-die assemblies and the growing importance of sensor-driven analog data at th…