SerDes
2025 Automotive SerDes/Bridge Chip Report - A Concise Market Report for the Engineering Community (2025–2035)
Disclaimer The information presented in this article is for informational and educational purposes only and reflects p…
openGMSL
OpenGMSL: FAQ on Key Benefits, Ecosystem Dynamics, and Competitive Landscape
Q1. What is OpenGMSL and how does it relate to GMSL2 and GMSL3? OpenGMSL is a new open standard built upon Analog Devi…
Product Requirements Document
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A PRD empowers informed, effective product development decisions while serving as a goalpost, guide, and reference poin…
Top10
Top 10 Reasons Why Service Roles in Semiconductors Are a Strategic Choice for Engineers
In the semiconductor industry, engineers often face a pivotal decision: pursue a role at a product company or opt for o…
TSMC
TSMC Exits GaN Wafer Foundry Business to Focus on Advanced Packaging
Hsinchu, Taiwan – July 6, 2025 – Taiwan Semiconductor Manufacturing Company (TSMC), the world’s leading contract chipm…
Semiconductor
Gallium Nitride: The Wide-Bandgap Semiconductor Powering the Future
Gallium nitride (GaN) is a wide-bandgap compound semiconductor that has become a cornerstone of modern electronics, off…
Market Reports
High-End Performance Packaging Market Report 2025–2030
High-End Performance Packaging Market Report 2025–2030 Executive Summary The High-End Performance Packaging (HEPP) …
Semiconductor
Gallium Arsenide: The Semiconductor Powering Modern Electronics
Gallium arsenide (GaAs) is a compound semiconductor material that has become a cornerstone of the modern electronics in…