Silicon sort testing is a type of testing performed on individual silicon wafers before the wafers are diced into individual chips. The purpose of silicon sort testing is to identify and eliminate any defective wafers before they are processed further, which helps to improve the yield and quality of the final product.
During silicon sort testing, the wafers are subjected to a series of electrical tests to identify any defects, such as shorts or opens, and to measure key electrical parameters, such as resistance, capacitance, and leakage current. The results of these tests are used to sort the wafers into different bins based on their quality and electrical characteristics. The highest-quality wafers are typically used for the manufacture of high-performance chips, while lower-quality wafers are used for chips with lower performance requirements.
Silicon sort testing is a critical step in the manufacturing process of silicon chips and integrated circuits, as it helps to identify and eliminate defective wafers before they are processed further. By improving the yield and quality of the final product, silicon sort testing helps to reduce the cost of production and improve customer satisfaction.
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