Showing posts with label 450mm. Show all posts
Showing posts with label 450mm. Show all posts

Intel opens China fab


Intel Corp. has begun operations within its first fab in China, according to Dow Jones. In 2007, Intel won approval to build a $2.5 billion, 300-mm wafer plant in northern China for chip sets. The plan called for the fab to be in the city of Dalian. The fab will produce 65-nm devices.

Intel is also expanding in the U.S. As reported, Intel recently confirmed speculation that it will build a new R&D wafer fab in Hillsboro, Ore., and upgrade other existing U.S. facilities for 22-nm production at a total investment of between $6 billion and $8 billion.

The investment will create 800 to 1,000 permanent high-tech jobs and 6,000 to 8,000 construction jobs, Intel (Santa Clara, Calif.) said. The new development fab in Oregon, to be known as D1X, is slated for R&D startup in 2013.

One analyst thinks the fab will be ''450-mm ready.'' [Via: EETimes]

Is Intel prepping up for 450mm wafer sizes?


Is Intel preparing to push the issue with regard to its desire to move to 450-mm wafer sizes? One analyst thinks so. While most equipment is nowhere near ready at this stage (development has been limited ), C.J. Muse, an analyst with Barclays Capital, thinks the No. 1 chipmaker could specify that its newly announced D1X development fab in Oregon will be 450-mm capable (meaning it can accommodate 450-mm processing when/if the equipment becomes available).

Considering that Intel, Samsung and TSMC have said in the past that they want to see 450-mm development fabs by 2012 (fat chance), Intel almost has no choice but to build D1X with enough space to accommodate 450-mm processing. While the chances of the tools being ready for 450-mm by that date are slim, Intel must at least plan for the contingency if the company wants to send the message to its equipment suppliers that it is serious about this. While the 450-mm ball is rolling to some extent (450-mm wafer specs are ready; handlers and interfaces may be also), the question is when the big gear like lithography, CVD, RTP, etch systems and others, will be ready. Don't be surprised to see Intel make a public statement about this fab being 450-mm capable as a way to turn up the heat and spur tool development by equipment vendors who have mostly been dragging their feet. [via: EETimes]