IEEE Symposium on Low-Power and High Speed Chips
April 15-17, 2009
COOL Chips is an International Symposium initiated in 1998 to present advancement of low-power and high-speed chips. The symposium covers leading-edge technologies in all areas of microprocessors and their applications. The COOL Chips XII is to be held in Yokohama on April 15-17, 2009, and is targeted at the architecture, design and implementation of chips with special emphasis on the areas listed below. The COOL Chips Organizing Committee will ask the MICRO to publish selected papers in a special issue on COOL Chips XII.
Contributions are solicited in the following areas:
* Low Power-High Performance Processors for Multimedia, Digital Consumer Electronics, Mobile, Graphics, Encryption, Robotics, Networking and Biometrics.
* Novel Architectures and Schemes for Single Core, Multi-Core, Embedded System, Reconfigurable Computing, Grid, Ubiquitous, Dependable Computing and Wireless.
* Cool Software including Binary Translations, Compiler Issues and Low Power Techniques.