Disclaimer:
The Wafer Yield Calculator provided here is intended solely for educational and exploratory purposes. This tool is designed to assist users in understanding and experimenting with wafer yield calculations using various models (e.g., Murphy's, Poisson, Negative Binomial, and Bose-Einstein).
The results and visualizations generated are based on simplified assumptions and default parameters (e.g., 5mm die dimensions, 0.4 defects/cm²) and should not be considered as definitive or production-ready data.
The Digital Electronics Blog does not guarantee the accuracy, reliability, or suitability of the tool for any specific application, including commercial manufacturing or decision-making processes.
Users are solely responsible for verifying the results with professional engineering practices and industry-standard methods.
The Digital Electronics Blog shall not be liable for any damages, losses, or consequences arising from the use or misuse of this tool.
Use it at your own discretion for exploration and learning purposes only.
The below Wafer Yield Calculator is a tool designed to simulate and analyze the yield of semiconductor wafers based on various yield models, including Murphy's Model, Poisson Model, Negative Binomial Model, and Bose-Einstein Model.
This interactive application allows users to input key parameters such as die dimensions, scribe lanes, wafer diameter, defect density, edge loss, and manual placement shifts, while visualizing the distribution of good, defective, partial, and wasted dies on a wafer map.
With defaults set to a die width and height of 5mm and a defect density of 0.4 defects/cm², the tool provides an immediate starting point for analysis.
The wafer map features a grey background outside a red outer boundary, a white area between the boundary and a grey exclusion line, and color-coded dies: green for good dies, grey for defective dies (with white dots), yellow for partial dies (with white and black dots), and red for wasted dies (with white dots).
This tool is ideal for semiconductor engineers and researchers to understand wafer design and predict production yields with assumptions.
Examples of Usage
1. Basic Yield Analysis with Default Settings:
Input:
Die Width = 5mm
Die Height = 5mm
Scribe H = 0.2mm
Scribe V = 0.2mm
Wafer Diameter = 300mm
Defect Density = 0.4 defects/cm²
Edge Loss = 0mm
Shift H = 0mm
Shift V = 0mm
Centering = Yes
Yield Model = Murphy's Model.
Action: Click "Calculate Yield".
Result:
Yield ≈ 73.8%
Total Dies ≈ 13381
Good Dies ≈ 9870
Defective Dies ≈ 3511
Partial Dies ≈ 150
Wasted Dies ≈ 150
The wafer map displays green good dies, grey defective dies with white dots, yellow partial dies with white and black dots, and red wasted dies with white dots, all within the exclusion radius.
Use Case:
Quick assessment of yield with standard parameters for a 300mm wafer.
2. Comparing Yield Models:
Input:
Same as above, but change Yield Model to Poisson Model.
Action: Click "Calculate Yield".
Result:
Yield ≈ 77.6% (Poisson: `exp(-0.4 * 0.05284)`),
Total Dies ≈ 13381,
Good Dies ≈ 10381,
Defective Dies ≈ 3000,
Partial Dies ≈ 150,
Wasted Dies ≈ 150.
The map remains visually similar but reflects the new yield distribution.
Use Case:
Evaluate how different yield models affect the predicted good die count for process optimization.
3. Adjusting for Edge Loss and Manual Placement:
Input:
Die Width = 5mm,
Die Height = 5mm,
Scribe H = 0.2mm,
Scribe V = 0.2mm,
Wafer Diameter = 300mm,
Defect Density = 0.4 defects/cm²,
Edge Loss = 10mm,
Shift H = 2mm,
Shift V = 1mm,
Centering = No,
Yield Model = Negative Binomial Model.
Action: Click "Calculate Yield".
Result:
Yield ≈ 75.2% (Negative Binomial with r = 0.5),
Total Dies ≈ 12250,
Good Dies ≈ 9210,
Defective Dies ≈ 3040,
Partial Dies ≈ 140,
Wasted Dies ≈ 140.
The map shifts slightly due to manual placement, with fewer total dies due to edge loss.
Use Case:
Simulate the impact of edge exclusion and non-centered die placement on yield.
4. High Defect Density Scenario:
Input:
Die Width = 5mm,
Die Height = 5mm,
Scribe H = 0.2mm,
Scribe V = 0.2mm,
Wafer Diameter = 300mm,
Defect Density = 1.0 defects/cm²,
Edge Loss = 0mm,
Shift H = 0mm,
Shift V = 0mm,
Centering = Yes,
Yield Model = Bose-Einstein Model.
Action: Click "Calculate Yield".
Result:
Yield ≈ 33.3% (Bose-Einstein: `1 / (1 + 1.0 * 0.05284)`),
Total Dies ≈ 13381,
Good Dies ≈ 4455,
Defective Dies ≈ 8926,
Partial Dies ≈ 150,
Wasted Dies ≈ 150.
The map shows a significant increase in defective dies.
Use Case:
Assess yield under high defect conditions to identify process improvement needs.
These examples demonstrate the tool's flexibility in handling various scenarios, making it a valuable asset for yield prediction and wafer design optimization.
These examples demonstrate the tool's flexibility in handling various scenarios, making it a valuable asset for yield prediction and wafer design optimization.
Wafer Yield Calculator
Calculate wafer yield using different models.
Wafer Map
Defective Dies: ■
Good Dies: ■
Wasted Dies: ■
Partial Dies: ■
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