Kudos to IBM, Intel and New York state for putting together a deal that will make upstate New York the center of R&D work for chip production on 450-mm and the development of 22- and 14-nm process technology for IBM's so-called "fab club," the Common Platform Alliance. According to New York Governor Andrew Cuomo, the deal, which involves $4.4 billion of investment, will create about 4,400 jobs and help the region retain another 2,500. Many of those jobs might just have easily have ended up in Taiwan, South Korea, Abu Dhabi or elsewhere. The deal is a coup for New York, which is presumably offering the companies tax breaks or other incentives to locate the projects there. (New York state itself is kicking in some $400 million over five years, but Gov. Cuomo made it clear in a statement announcing the projects that no private company will receive any state funds as part of the agreement.) Albany, already home to the semiconductor research consortium Sematech, the Albany Nanotech Complex and, soon, the Global 450 Consortium, increasingly appears to have surpassed the Silicon Valley as the place to be for semiconductor industry R&D. [More]
Showing posts with label Fab. Show all posts
Showing posts with label Fab. Show all posts
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Intel opens China fab
Intel Corp. has begun operations within its first fab in China, according to Dow Jones. In 2007, Intel won approval to build a $2.5 billion, 300-mm wafer plant in northern China for chip sets. The plan called for the fab to be in the city of Dalian. The fab will produce 65-nm devices.
Intel is also expanding in the U.S. As reported, Intel recently confirmed speculation that it will build a new R&D wafer fab in Hillsboro, Ore., and upgrade other existing U.S. facilities for 22-nm production at a total investment of between $6 billion and $8 billion.
The investment will create 800 to 1,000 permanent high-tech jobs and 6,000 to 8,000 construction jobs, Intel (Santa Clara, Calif.) said. The new development fab in Oregon, to be known as D1X, is slated for R&D startup in 2013.
One analyst thinks the fab will be ''450-mm ready.'' [Via: EETimes]
Intel is also expanding in the U.S. As reported, Intel recently confirmed speculation that it will build a new R&D wafer fab in Hillsboro, Ore., and upgrade other existing U.S. facilities for 22-nm production at a total investment of between $6 billion and $8 billion.
The investment will create 800 to 1,000 permanent high-tech jobs and 6,000 to 8,000 construction jobs, Intel (Santa Clara, Calif.) said. The new development fab in Oregon, to be known as D1X, is slated for R&D startup in 2013.
One analyst thinks the fab will be ''450-mm ready.'' [Via: EETimes]
