Displaying posts in the categorySemiconductor Manufacturing
Semiconductor Manufacturing articles
Semiconductor Manufacturing
Originally published on LinkedIn . Advanced packaging is now one of the main ways the semiconductor industry improves system performance. As transistor scaling slows and gets more expensive, the gains increasingly come from how dies are split, stacked and connected inside one package. That makes packaging a design decision taken at the start of architecture work, not a step at the end of manufacturing. Packaging is no longer a footnote in sem…
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Murugavel Ganesan
August 27, 2026
Semiconductor Manufacturing
EMIB and CoWoS are the two leading ways to join several chiplets and HBM stacks in one package. Intel's EMIB (Embedded Multi-die Interconnect Bridge) embeds small silicon bridges in an organic substrate only where two dies meet. TSMC's CoWoS (Chip on Wafer on Substrate) places all the dies on a large interposer that carries the wiring between them. In short, EMIB saves silicon and cost and eases warpage, while CoWoS has been the proven r…
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Murugavel Ganesan
May 12, 2026
Tutorials
Choosing a BGA package changes far more than the footprint. The package type, ball pitch, body size and thermal design decide how many PCB layers you need, whether the board needs HDI microvias, how tight the assembly window is, how solder joints are inspected and how long they survive thermal cycling. That is why BGA selection should be reviewed by design, PCB fabrication and assembly teams together, not left as a schematic-level decision. Ba…
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The Editor's Desk
May 04, 2026
Special Reports
India is often cited as having about 20% of the world's semiconductor design engineers. Until recently, almost none of them were designing chips for Indian companies. That is now changing, and fast. India's semiconductor moment is the shift from supplying design engineers to the world's chip companies to building Indian-owned chip products and the factories to make them. Government programmes (the India Semiconductor Mission and …
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Murugavel Ganesan
March 14, 2026
Technology
A PDK (Process Design Kit) is the package of models, rules, libraries and verification decks that a foundry supplies for one manufacturing process, so that chip designers can simulate, lay out and check a design before it is built. It is the foundry's process described in a form that EDA tools can read. Every chip that reaches silicon, from a smartphone processor to a power converter, was designed against a PDK, which is why it is often call…
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Murugavel Ganesan
September 16, 2025
Semiconductor Manufacturing
Gallium nitride (GaN) is a wide-bandgap III-V compound semiconductor with a bandgap of about 3.4 eV, three times that of silicon. That wide bandgap gives it a breakdown field roughly ten times higher than silicon, and its AlGaN/GaN heterostructure forms a fast, high-density electron channel without doping. Together these let GaN transistors switch faster, at higher voltage and with lower losses than silicon in chargers, power supplies and RF amp…
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Murugavel Ganesan
July 01, 2025
