Displaying posts in the categoryMemory
Memory articles
Special Reports
DRAM prices have roughly doubled in 2026, high bandwidth memory (HBM) for 2027 is largely sold out, and phone and PC makers are paying for it. The cause is simple to state: every AI accelerator ships with stacks of HBM, and HBM uses far more wafer capacity per bit than ordinary memory. When the three big memory makers point their fabs at AI, everyone else gets less. This post explains how HBM is built, why it squeezes the rest of the market, w…
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Murugavel Ganesan
November 03, 2026
Memory
In-memory compute (IMC) does the arithmetic inside the memory array instead of moving data out to a processor. For AI inference, the weights stay in place, the input activations drive the wordlines, and each bitline adds up the products, so the multiply-accumulate happens where the data lives. It matters because moving a number costs far more energy than computing with it: in published 45 nm figures, a 32-bit DRAM read costs about 640 pJ against…
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Murugavel Ganesan
August 27, 2026
Semiconductor Industry
Executive summary: the semiconductor market enters 2026 split in two. AI and high-performance computing (HPC) are growing fast and are limited by physical supply, above all high-bandwidth memory (HBM), power and skilled people, while automotive, industrial and consumer chips are still working through slow inventory corrections. As we exit 2025, the limits are less about software and more about the hard walls of physics: energy grids are stretch…
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Murugavel Ganesan
December 19, 2025
Special Reports
A silicon interposer is a thin slice of silicon that acts as a high-density electrical bridge between multiple dies (chiplets) and the package substrate. It allows several semiconductor components to be connected using very short interconnects, fine-pitch routing, and extremely high bandwidth compared to a traditional printed circuit board (PCB) or organic substrate. In simple terms, a silicon interposer is the “mini-silicon mo…
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Murugavel Ganesan
November 21, 2025
Tutorials
Updated 2026 CoWoS or EMIB? If your product is bound by HBM bandwidth and needs many memory stacks next to one or two very large logic dies, TSMC's CoWoS family (today mostly CoWoS-L) is still the lowest-risk choice. If you are building a portfolio of chiplet products, need very large packages at a controlled cost, or want to mix dies from different nodes and sources, Intel's EMIB and the newer EMIB-T are increasingly strong options. T…
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Murugavel Ganesan
November 19, 2025
Video
Virtual memory is a memory management technique in which every program sees its own private, contiguous address space, while the operating system and the processor's memory management unit (MMU) map those virtual addresses onto physical RAM in fixed-size blocks called pages. It lets many programs run at once without overwriting each other, lets a program use more memory than is physically free by keeping some pages on disk, and avoids the fr…
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Murugavel Ganesan
January 09, 2024
