Top 10 Cutting-Edge Semiconductor Fabs Worldwide (2024 List)

This list, first shared on LinkedIn in November 2024, picks ten cutting-edge semiconductor fabs around the world based on their process technology and production capacity. At the time, TSMC, Samsung and Intel led with fabs running 3 nm to 5 nm class processes for smartphone, PC and AI chips, while GlobalFoundries, UMC, SMIC and others focused on mature and specialty nodes. The figures below are as posted in 2024; some have been corrected or flagged where public sources disagree.

Key takeaways

• As of late 2024, only TSMC and Samsung were shipping 3 nm class logic in volume; TSMC's Fab 18 in Tainan was the main 3 nm site.
• Almost all leading fabs use 300 mm wafers; many specialty and analog fabs still run 200 mm.
• Capacity figures for individual fabs are rarely published by the companies, so the wafers-per-month numbers in this list are estimates and should be read as rough orders of magnitude.
• Fab names and numbering differ by company, and one company may use the same number for several phases or sites.
• Competition is shaped not only by technology but also by supply chain disruptions, geopolitics and sustainability.

The competitive picture in 2024

The semiconductor industry is fiercely competitive, with companies continually pushing technological boundaries. Giants like TSMC, Samsung and Intel dominate with advanced fabs producing 3 nm and 5 nm technologies, critical for high-performance chips in smartphones and AI applications. Emerging players and significant R&D investment intensify competition. These companies not only strive for leadership but also navigate supply chain disruptions, geopolitical tensions and sustainable manufacturing challenges to deliver the next generation of semiconductor solutions.

The top 10 list, as posted in November 2024

Here is the list of cutting-edge semiconductor fabs, based on their advanced technologies and production capabilities. Capacity figures are as published in the original post and have not been confirmed by the companies.

#	Company and fab	Location	Wafer size	Process technology	Capacity (wafers/month, as posted)
1	TSMC, Fab 18	Tainan, Taiwan	300 mm	3 nm (also 5 nm)	100,000
2	Samsung Electronics, Fab S4 (see note)	South Korea	300 mm	3 nm	80,000
3	Intel, Fab 42	Chandler, Arizona, USA	300 mm	Posted as 7 nm, 5 nm; see note	70,000
4	GlobalFoundries, Fab 8	Malta, New York, USA	300 mm	14 nm, 12 nm	60,000
5	UMC, Fab 12	Taiwan	300 mm	14 nm, 12 nm	50,000
6	SMIC, Fab 15	China	300 mm	14 nm, 12 nm	40,000
7	Micron Technology, Fab 11	Taoyuan, Taiwan (corrected, see note)	300 mm	20 nm, 1X nm DRAM	35,000
8	Texas Instruments, posted as Fab 4	USA	300 mm	65 nm, 45 nm	30,000
9	Infineon Technologies, posted as Fab 1	Germany	300 mm	Posted as 40 nm, 28 nm; see note	25,000
10	NXP Semiconductors, posted as Fab 1	Netherlands	Posted as 300 mm; see note	Posted as 40 nm, 28 nm; see note	20,000

Notes and corrections on each entry

1. TSMC Fab 18

Fab 18 in the Southern Taiwan Science Park, Tainan, is TSMC's main 5 nm and 3 nm GigaFab complex and has several phases. TSMC does not publish capacity per fab, so the 100,000 wafers per month figure is an estimate.

2. Samsung

Samsung began 3 nm production with gate-all-around (GAA) transistors at its Hwaseong campus in Korea in mid-2022, and reported a shipment ceremony at its V1 line there in July 2022. The fab name S4 in the original post could not be confirmed from Samsung sources; the 3 nm work is reported at Hwaseong, with expansion planned to Pyeongtaek.

3. Intel Fab 42

In 2017 Intel announced it would complete Fab 42 in Chandler, Arizona for what it then called its 7 nm process. Intel later renamed its nodes, and Fab 42 is widely reported to have run Intel 7 (previously called 10 nm Enhanced SuperFin). The 7 nm and 5 nm labels in the original list reflect the older naming and should be treated with care.

4 to 6. GlobalFoundries, UMC and SMIC

GlobalFoundries Fab 8 in Malta, New York runs its 14 nm and 12 nm FinFET processes. UMC's Fab 12A in Tainan is its most advanced site, with 14 nm FinFET and 28 nm processes. SMIC's 14 nm class production is reported mainly at its Shanghai site; the Fab 15 name was not confirmed.

7. Micron

Micron's Fab 11 is in Taoyuan, Taiwan (the former Inotera fab), not in the USA as first posted; the location has been corrected. Micron's newer DRAM nodes are named 1-alpha and 1-beta, so the 20 nm and 1X nm labels describe older generations.

8. Texas Instruments

TI's 300 mm analog and embedded fabs include RFAB1 and RFAB2 in Richardson, Texas, and LFAB in Lehi, Utah. TI has said LFAB supports 65 nm and 45 nm processes, so this entry most likely refers to LFAB. A TI fab called Fab 4 could not be confirmed.

9. Infineon

Infineon runs a 300 mm fab in Dresden, Germany, focused on power semiconductors and other technologies. Infineon is widely reported to source many of its 40 nm and 28 nm microcontrollers from foundry partners, so the process figures for this entry are unconfirmed.

10. NXP

NXP's main Dutch fab, ICN8 in Nijmegen, uses 200 mm wafers, according to reporting by Bits&Chips. NXP's 300 mm plans, through joint ventures in Dresden and Singapore, were scheduled to start production around 2027. The 300 mm and 28 nm figures for a Netherlands fab in the original list are therefore not supported by public sources and are kept here only as originally posted.

How to read fab capacity figures

Capacity is usually quoted in wafer starts per month (WSPM), often as 300 mm equivalents. A rough sense of scale, using illustrative numbers: if a 300 mm wafer holds about 640 gross dies of 100 mm² each, a fab running 100,000 wafers per month could start around 64 million such dies a month, before yield loss. Real output depends on die size, yield and how much of the fab runs each node.

The original LinkedIn post

FAQ

Which company had the most advanced fabs in 2024?

TSMC, with 3 nm in high volume at Fab 18 and 2 nm in preparation, followed by Samsung with 3 nm GAA.

Why do fabs use 300 mm wafers?

A 300 mm wafer has about 2.25 times the area of a 200 mm wafer, which lowers the cost per die for high-volume products.

Are fab capacity numbers official?

Rarely. Most companies report total capacity, not per-fab capacity, so per-fab numbers are usually estimates by analysts or press.

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