According to EETimes Intel is already shipping data only LTE modems to customers and data-and-voice multimode modem would ship during 2013. Intel is significantly lagging in the integrated modem and processor space that puts Intel way behind Qualcomm Inc., which already offers integrated LTE capability in its Snapdragon line of application processors. Intel's wireless capabilities are largely credited to the acquisition of wireless business unit of Infineon Technologies AG (Munich, Germany). This very team is known for its solid engineering capabilities while being cost effective and cost competitive.
Showing posts with label Infineon. Show all posts
Showing posts with label Infineon. Show all posts
Infineon's work in progress - The story for our time
How massive restructuring has created a novel business model at the semiconductor stalwart. If there has been a constant at Infineon, it has been change. From a division of giant Siemens, to a broad-line integrated semiconductor device manufacturer (IDM), to an IDM without a DRAM business, to a bankruptcy candidate, to a fabless powerhouse in smart-phone silicon, to what may be an entirely new model for a semiconductor company, Infineon has illustrated the maxim that a company's only real intellectual equity is its ability to change. In conversation with EDN, Infineon CEO Peter Bauer sketched out a fascinating trajectory.
"Today, the competition is not between companies. It is between countries. For instance, China is investing, I believe the figure is, $20 billion in electric cars. But in Germany, even more than in the USA, the notion of subsidy is disliked. The government believes in the operation of free markets. Perhaps the future is coming down to differences in industrial policies. - Peter Bauer, CEO - Infineon Technologies AG"
"Today, the competition is not between companies. It is between countries. For instance, China is investing, I believe the figure is, $20 billion in electric cars. But in Germany, even more than in the USA, the notion of subsidy is disliked. The government believes in the operation of free markets. Perhaps the future is coming down to differences in industrial policies. - Peter Bauer, CEO - Infineon Technologies AG"
Intel announces first Multistandard GSM Baseband chip and the much awaited Medfield processor
Intel has started production of its Medfield Application processor for smartphones and is sending samples to phone manufacturers. Intel also announced a low power, multi-standard baseband processor, samples of which would start shipping in the second half of this year. The new baseband processor will support LTE, a fourth generation, high-speed network technology currently being deployed by carriers, as well as older 3G and 2G technologies. Intel expects to make this chip widely available in the second half of next year.
Medfield is Intel's second smartphone processor. The first, Moorestown, did not have much success in the market due to power consumption too high for smartphones. Medfield and Moorestown are based on Intel's Atom processor. Medfield, which is built on the company's latest 32-nanometer manufacturing process, is expected to be better equipped for smartphones. Smaller in size and consuming less power than the 45-nm Moorestown, the new chip is expected to enter mass production later in the year. Intel has said Medfield-powered smartphones will hit the market this year. The company has not named the manufacturers. Intel dominates the processor market for PCs, but is playing catch up in the smartphone market, which is ruled today by processors based on the designs of ARM Holdings in the U.K. ARM processors are used by all the major smartphone makers, including Apple, Samsung, LG, HTC, Research In Motion, and others.
Intel's biggest advantage over ARM is in manufacturing. Intel is expected to move to a 22-nm manufacturing process next year, which is when ARM is headed to where Intel is today -- 32 nm. Size matters because reducing the size of circuitry on a chip boosts performance and lowers active power consumption. Therefore, Intel in time could produce a higher performing chip that's less expensive than ARM's. ARM is expected to stay on top at least till end of next year.
The LTE chip stems from Intel's acquisition last month of Infineon Technologies' Wireless Solutions business. Intel's strengths in communications before the acquisition was in Wi-Fi and WiMax chips. The acquisition has added 2G, 3G and 4G LTE technologies.
Medfield is Intel's second smartphone processor. The first, Moorestown, did not have much success in the market due to power consumption too high for smartphones. Medfield and Moorestown are based on Intel's Atom processor. Medfield, which is built on the company's latest 32-nanometer manufacturing process, is expected to be better equipped for smartphones. Smaller in size and consuming less power than the 45-nm Moorestown, the new chip is expected to enter mass production later in the year. Intel has said Medfield-powered smartphones will hit the market this year. The company has not named the manufacturers. Intel dominates the processor market for PCs, but is playing catch up in the smartphone market, which is ruled today by processors based on the designs of ARM Holdings in the U.K. ARM processors are used by all the major smartphone makers, including Apple, Samsung, LG, HTC, Research In Motion, and others.
Intel's biggest advantage over ARM is in manufacturing. Intel is expected to move to a 22-nm manufacturing process next year, which is when ARM is headed to where Intel is today -- 32 nm. Size matters because reducing the size of circuitry on a chip boosts performance and lowers active power consumption. Therefore, Intel in time could produce a higher performing chip that's less expensive than ARM's. ARM is expected to stay on top at least till end of next year.
The LTE chip stems from Intel's acquisition last month of Infineon Technologies' Wireless Solutions business. Intel's strengths in communications before the acquisition was in Wi-Fi and WiMax chips. The acquisition has added 2G, 3G and 4G LTE technologies.
Infineon takes over LTE specialist "Blue Wonder"
Infineon's Wireless Solutions unit has been working together with the Dresden design house "Blue Wonder" on the development of LTE technologies for one and a half years. Now Infineon has taken over the Saxony-based company together with its 50 employees.
Blue Wonder describes itself as a design house for LTE-IP and mobile communications
solutions serving the telecommunications and semiconductor industries. Blue Wonder’s team is made up of highly qualified specialists for mobile communications
solutions.
The core competencies encompass mobile broadband modem design and OFDMbased system development. First and foremost, the company’s special know-how in LTE Layer 1 supplements and complements the LTE development work of WLS and hence in future of Intel Mobile Communications.
The 4G mobile standard Long Term Evolution (LTE) is the successor of today’s 3G
standard UMTS/HSPA. It provides peak data rates of 150 Mbit/s downlink and 50
Mbit/s uplink. The perfor-mance in surfing the internet, playing online games and in
video telephony is as if the mobile devices were connected via DSL to the fixed
network.
Blue Wonder describes itself as a design house for LTE-IP and mobile communications
solutions serving the telecommunications and semiconductor industries. Blue Wonder’s team is made up of highly qualified specialists for mobile communications
solutions.
The core competencies encompass mobile broadband modem design and OFDMbased system development. First and foremost, the company’s special know-how in LTE Layer 1 supplements and complements the LTE development work of WLS and hence in future of Intel Mobile Communications.
The 4G mobile standard Long Term Evolution (LTE) is the successor of today’s 3G
standard UMTS/HSPA. It provides peak data rates of 150 Mbit/s downlink and 50
Mbit/s uplink. The perfor-mance in surfing the internet, playing online games and in
video telephony is as if the mobile devices were connected via DSL to the fixed
network.
Infineon wireless unit to be a "seperate legal entity"?
From the open forum that happened at Infineon today it was made clear that the carved out wireless division will be a separate legal entity with a new name (that is being figured out). It was also told that all the acquired employees will be blue badge Intel employees with their own HR, Marketing and Sales team that will work independently. That's interesting!
Intel buys Infineon wireless
As per the management email sent to Infineon employees this morning, Infineon and Intel have signed the contracts related to the sale of Infineon's Wireless business to Intel Corporation for a sum of approximately US Dollars 1.4bn. Initial reports suggest that IFX's Wireless division is to become a standalone business including all related functions within the Intel group. According to the latest status they expect around 3,400 Infineon employees worldwide will transfer to the new company.
Intel's acquisition of Infineon's wireless business
Linley Gwennap says "Making it clear that money is no object in its quest to become a major player in the smartphone market, Intel plans to acquire the wireless operations of Infineon. The deal is firm but has not yet been announced, as final details are being negotiated. We believe the purchase price exceeds $1.2 billion, ranking it as one of Intel’s largest acquisitions ever. Infineon’s cellular and GPS technology will complement Intel’s Atom processor and Wi-Fi expertise, allowing Intel to deliver a complete solution for the rapidly growing smartphone and tablet-computer markets. But will Intel’s second attempt in the cellular market end better than the first? What do you think about this aquisition? Do you think Infineon's recently acquired technology penetration through partnership with major mobile players is worthwhile to be signed off for the sake of immediate money?
Job openings @ Infineon Technologies India Pvt Ltd
Infineon Technologies India Pvt Ltd has some openings for full time and contract positions. If you are interested in applying for these positions, please email us directly with the title of the job description as the subject for faster processing. Please don't email us to inquire about the status. If you are shortlisted, you will be contacted by the company or the hiring manager directly. Please click on the title for more info.
Full Time Position
[#1] Job Description For mixed signal simulation
Experience: 5 to 9 years in mixed signal functional verification
Education : B. Tech in Electronics or Computer Science
Areas of Responsibility:
1) Evaluation and integration of latest tool version into functional verification sub flow with very close link to functional verification and AMS sub flow team
2) Applications and Support of tools for Mixed Signal Functional Verification
3) Definition and implementation of mixed signal simulation methodology
4) Contacts to EDA vendors to synchronize their development with IFX specific
requirements and follow-up open issues
Skills/Requirement:
Preferred with Tools AdvancedMS or AMS Designer.
Basic knowledge in analog circuit design and analog simulation.
Solid experiences in programming skills (Skill, Perl, shell scripts).
Solid experience in VHDL (VHDL-AMS) Experiences in customer support of European customers Team player
Consultant Requirements :
[#1] Job Descriptions For Timing abstraction
Experience: 4 to 5 years
Education : B. Tech in Electronics or Computer Science
Operating Systems : Linux, Solaris, Windows
Programming : Proficient in C++ or Perl Object Oriented Programming and Shell scripting
Domain Knowledge:
Advanced knowledge of Timing at transistor level
Have been responsible for generating timing models at least using spice simulators
Should have a working background in CAD flow development for at least 3 years
Wish List:
Past experience in custom macros or standard cells.
Understanding of Spice Netlist, Bsim Models.
Knowledge of Nanotime : Added advantage.
Experience in transisitor level design.
Job Responsibility:- Responsible for
Leading the Timing modelling topics for full custom macros
Co-ordinating with the technical interface across the continents
Design Services, related to timing modelling for various macros
Development, support and maintenance of script in Perl for Timing Modelling and analysis for Full Custom Macros.
Project planning, customer interfacing, methodology development
Guiding, mentoring other team members for accomplishment of the project
Following all processes, QA, Reporting
Documentations, user manual, test plan generation, testing and training documentation
[#2] Job Descriptions For Timing abstraction
Experience: 1 to 4 years
Education : B. Tech in Electronics or Computer Science
Operating Systems : Linux, Solaris, Windows
Programming : Proficient in C++ or Perl Object Oriented Programming and Shell scripting
Domain Knowledge: Basics of Timing Setup and Hold.
Wish List:
Past experience in custom macros or standard cells is beneficial.
Understanding of Spice Netlist, Bsim Models.
Knowledge of Nanotime : Added advantage.
Experience in transisitor level design.
Job Responsibility: Responsible for development of script in Perl for Timing Modelling and analysis for Full Custom Macros.
Support and Maintain all scripts which are required for timing abstraction and Liberty file handling
Responsible to following all processes
Documentations, user manual, test plan generation, testing and training documentation
[#3] Job Descriptions For Macroprep
Experience: 1 to 4 years
Education : B. Tech in Electronics or Computer Science
Operating Systems : Linux, Solaris, Windows
Programming : Proficient in C++ or Perl Object Oriented Programming and Shell scripting
Domain Knowledge: Basic knowledge of Spice, VHDL, Verilog, GDS, Synopsys Liberty, LEF views Macro preparation and IP reuse.
Job Responsibility: Responsible for development of script in Perl for Object Oriented Interface to database built by the parsers of the above specified views
Responsible for unit testing and system testing for the components developed
Responsible for all relevant documentations
[#4] Job Description for Functional Verification flow
Experience: 1 to 4 years
Education : B. Tech in Electronics or Computer Science
Operating Systems : Linux, Solaris, Windows
Programming : Proficient in Perl Programming and Shell scripting
Requirement: Proficient in functional verification tools: simulation, debug, formal(property check), mixed signal simulation, specman (Mentor tools preferred).
Knowledge of HDL and verification language/methodology such as e or SV/OVM
Should have a working background in CAD flow development.
Job Responsibility:- Responsible for Development, support and maintenance of script in Perl for functional verification flow. Responsible for unit testing and system testing for the components developed Pilot testing and deployment of functional verification flow on customer projects. Customer interfacing, methodology development.
Following all processes, QA, Reporting
Documentations, user manual, test plan generation, testing and training documentation
[#5] Job Description for Skill programming
Experience: 3+ years in skill programming
Education : B. Tech in Electronics or Computer Science
Operating Systems : Linux, Solaris, Windows
Programming : Proficient in skill Programming and scripting
Requirement: Experience in skill programming for GUI application integrated in Cadence design framework and database access functionality. Solid experience in analog design methodology for circuit and physical design, required for validation, verification & understanding the requirements.
Full Time Position
[#1] Job Description For mixed signal simulation
Experience: 5 to 9 years in mixed signal functional verification
Education : B. Tech in Electronics or Computer Science
Areas of Responsibility:
1) Evaluation and integration of latest tool version into functional verification sub flow with very close link to functional verification and AMS sub flow team
2) Applications and Support of tools for Mixed Signal Functional Verification
3) Definition and implementation of mixed signal simulation methodology
4) Contacts to EDA vendors to synchronize their development with IFX specific
requirements and follow-up open issues
Skills/Requirement:
Preferred with Tools AdvancedMS or AMS Designer.
Basic knowledge in analog circuit design and analog simulation.
Solid experiences in programming skills (Skill, Perl, shell scripts).
Solid experience in VHDL (VHDL-AMS) Experiences in customer support of European customers Team player
Consultant Requirements :
[#1] Job Descriptions For Timing abstraction
Experience: 4 to 5 years
Education : B. Tech in Electronics or Computer Science
Operating Systems : Linux, Solaris, Windows
Programming : Proficient in C++ or Perl Object Oriented Programming and Shell scripting
Domain Knowledge:
Advanced knowledge of Timing at transistor level
Have been responsible for generating timing models at least using spice simulators
Should have a working background in CAD flow development for at least 3 years
Wish List:
Past experience in custom macros or standard cells.
Understanding of Spice Netlist, Bsim Models.
Knowledge of Nanotime : Added advantage.
Experience in transisitor level design.
Job Responsibility:- Responsible for
Leading the Timing modelling topics for full custom macros
Co-ordinating with the technical interface across the continents
Design Services, related to timing modelling for various macros
Development, support and maintenance of script in Perl for Timing Modelling and analysis for Full Custom Macros.
Project planning, customer interfacing, methodology development
Guiding, mentoring other team members for accomplishment of the project
Following all processes, QA, Reporting
Documentations, user manual, test plan generation, testing and training documentation
[#2] Job Descriptions For Timing abstraction
Experience: 1 to 4 years
Education : B. Tech in Electronics or Computer Science
Operating Systems : Linux, Solaris, Windows
Programming : Proficient in C++ or Perl Object Oriented Programming and Shell scripting
Domain Knowledge: Basics of Timing Setup and Hold.
Wish List:
Past experience in custom macros or standard cells is beneficial.
Understanding of Spice Netlist, Bsim Models.
Knowledge of Nanotime : Added advantage.
Experience in transisitor level design.
Job Responsibility: Responsible for development of script in Perl for Timing Modelling and analysis for Full Custom Macros.
Support and Maintain all scripts which are required for timing abstraction and Liberty file handling
Responsible to following all processes
Documentations, user manual, test plan generation, testing and training documentation
[#3] Job Descriptions For Macroprep
Experience: 1 to 4 years
Education : B. Tech in Electronics or Computer Science
Operating Systems : Linux, Solaris, Windows
Programming : Proficient in C++ or Perl Object Oriented Programming and Shell scripting
Domain Knowledge: Basic knowledge of Spice, VHDL, Verilog, GDS, Synopsys Liberty, LEF views Macro preparation and IP reuse.
Job Responsibility: Responsible for development of script in Perl for Object Oriented Interface to database built by the parsers of the above specified views
Responsible for unit testing and system testing for the components developed
Responsible for all relevant documentations
[#4] Job Description for Functional Verification flow
Experience: 1 to 4 years
Education : B. Tech in Electronics or Computer Science
Operating Systems : Linux, Solaris, Windows
Programming : Proficient in Perl Programming and Shell scripting
Requirement: Proficient in functional verification tools: simulation, debug, formal(property check), mixed signal simulation, specman (Mentor tools preferred).
Knowledge of HDL and verification language/methodology such as e or SV/OVM
Should have a working background in CAD flow development.
Job Responsibility:- Responsible for Development, support and maintenance of script in Perl for functional verification flow. Responsible for unit testing and system testing for the components developed Pilot testing and deployment of functional verification flow on customer projects. Customer interfacing, methodology development.
Following all processes, QA, Reporting
Documentations, user manual, test plan generation, testing and training documentation
[#5] Job Description for Skill programming
Experience: 3+ years in skill programming
Education : B. Tech in Electronics or Computer Science
Operating Systems : Linux, Solaris, Windows
Programming : Proficient in skill Programming and scripting
Requirement: Experience in skill programming for GUI application integrated in Cadence design framework and database access functionality. Solid experience in analog design methodology for circuit and physical design, required for validation, verification & understanding the requirements.
Infineon introduces two RF-chips for LTE and 3G
Infineon has introduced two RF-chips for LTE and 3G - SMARTi LU for highest data rates with LTE, and SMARTi UEmicro for low cost 3G devices.SMARTi LU is a highly integrated 2G/3G/LTE multi-mode RF transceiver compliant to 3GPP Rel.7 and Rel.8. It supports up to six 3G and LTE Bands simultaneously with Quad Band GSM/EDGE. Its long feature list includes LTE FDD class 4 (up to 150Mbps downlink, 50Mbps uplink) MIMO Rx diversity (2Rx + 1Tx), HSPA+, HSPA, WCDMA and GSM/GPRS/EDGE. The device is supporting the global spread of HSPA/LTE spectrum throughout a wide variety of bands. With its MIPI DigRF v4 compliant high-speed digital Baseband interface, SMARTi LU sets a milestone towards “all digital” implementation and enables the silicon intensive baseband chips to follow a faster shrink path towards smaller technology nodes such as 32nm and below. SMARTi LU is based on a standard 65nm CMOS technology provided by multiple semiconductor foundries.
The SMARTi UEmicro is a single chip 2G/3G CMOS RF transceiver for the low end segment of the 3G market. It is a cost down version of the proven and widely adopted SMARTi UE with a backward compatible hard- and software interface via DigRF v3.09. With the elimination of external Low Noise Amplifiers (LNA’s) and a simplified co-banded RF frontend without Rx filters SMARTi UEmicro is perfectly matching the mass market requirements for ultra low cost 3G handsets. SMARTi UEmicro delivers exceptional RF performance for up to three of the globally used WCDMA bands plus Dual- or Quad-Band GSM/EDGE at lowest system cost.
The SMARTi UEmicro is a single chip 2G/3G CMOS RF transceiver for the low end segment of the 3G market. It is a cost down version of the proven and widely adopted SMARTi UE with a backward compatible hard- and software interface via DigRF v3.09. With the elimination of external Low Noise Amplifiers (LNA’s) and a simplified co-banded RF frontend without Rx filters SMARTi UEmicro is perfectly matching the mass market requirements for ultra low cost 3G handsets. SMARTi UEmicro delivers exceptional RF performance for up to three of the globally used WCDMA bands plus Dual- or Quad-Band GSM/EDGE at lowest system cost.
Invitation to Freshers!
Infineon India - Bangalore is planning for a Fresher's Event in September 08 & thereby invites CVs of friends whose association with the software industry have just begun and would like to be a part of the growing Infineon family for taking up more challenging assignments.
Please note that the below mentioned criteria need to be met for a CV to be short listed:
Please note that the below mentioned criteria need to be met for a CV to be short listed:
- The candidate should have 6 months to 2 yrs. of work experience on C Programming & Operating Systems (Mandatory).
- Qualification - BE / Batch / ME / M.Tech - Yr. 2007 or 2008 pass out with minimum 70% aggregate
- The Subject line of email should contain the following information in the below mentioned format:
<> - The File name should contain the following information in the below mentioned format:
<_>
- You will be updated on the status of your referral only when the candidate gets an offer letter from Infineon.
- Timeline for sending CVs: September 24th, 2008 to September 26th , 2008.
- Local candidates preferred (Outstation candidates need to bear to and fro expenses on their own).
- Please send the CVs to: one.nanometer@gmail.com only.
- Short listed candidates will be called for a written test on C followed by interview/s.
- If you have referred your friends profiles for the last 6 months, please do not resend those profiles.
3G iPhone rumored to be Infineon-powered, hitting "mid-year"
Hold the presses: Apple may be releasing a new iPhone this year...
with 3G! Crazy, we know. The latest iteration of this rumor comes to
us courtesy of UBS analysts, who say Infineon will likely be building
chips for the phone -- they're powering the current iPhone, so no real
surprise there. UBS is also betting on a mid-year 3G iPhone launch,
and thinks that EDGE production will ramp down early so Apple gets a
chance to clean out inventories. We've got a good feeling about this
one, guys.
with 3G! Crazy, we know. The latest iteration of this rumor comes to
us courtesy of UBS analysts, who say Infineon will likely be building
chips for the phone -- they're powering the current iPhone, so no real
surprise there. UBS is also betting on a mid-year 3G iPhone launch,
and thinks that EDGE production will ramp down early so Apple gets a
chance to clean out inventories. We've got a good feeling about this
one, guys.
Mobile TV heats up with Broadcom's 65-nm SOC
The official news is out!
Broadcom has just announced a monolithic digital CMOS mobile TV receiver/demodulator, that reduces power consumption by up to 40 percent and physical dimensions by up to 30 percent from current handset design budgets. Designed for global digital TV reception on portable devices, the BCM2940 chip supports VHF III, UHF IV and V bands. It also supports the EU/US L-bands and integrates a 4-Mb MPE-FEC SRAM to handle DVB-H parallel/consecutive streams and services. The chip offers various physical interfaces including SPI, SDIO and USB 2.0.
Ok that sound great and appetizing, but is there a Market really?
Sometime ago TI came up with its own single-chip DVB-H receiver, called the Hollywood using a 90-nm technology, but the company hasn't announced any major design wins.
ST put its project on the back burner more than a year ago.
Now noise from NXP or Infineon!!!!!!!
Infineon given it recent track record and recent aquisitions i would not be surprised if they throw one in pretty soon :-) it is more a speculation than prediction.
Lets wait and watch and do Read on... this article on EE Times..
Broadcom has just announced a monolithic digital CMOS mobile TV receiver/demodulator, that reduces power consumption by up to 40 percent and physical dimensions by up to 30 percent from current handset design budgets. Designed for global digital TV reception on portable devices, the BCM2940 chip supports VHF III, UHF IV and V bands. It also supports the EU/US L-bands and integrates a 4-Mb MPE-FEC SRAM to handle DVB-H parallel/consecutive streams and services. The chip offers various physical interfaces including SPI, SDIO and USB 2.0.
Ok that sound great and appetizing, but is there a Market really?
Sometime ago TI came up with its own single-chip DVB-H receiver, called the Hollywood using a 90-nm technology, but the company hasn't announced any major design wins.
ST put its project on the back burner more than a year ago.
Now noise from NXP or Infineon!!!!!!!
Infineon given it recent track record and recent aquisitions i would not be surprised if they throw one in pretty soon :-) it is more a speculation than prediction.
Lets wait and watch and do Read on... this article on EE Times..